Grinding and Polishing - ASM Internationalto the polishing head. 2. Grind the specimens at a contact pressure of 40 to 150 kPa on a bonded diamond platen for approximately 60 s or until the exposed.grinding polishing head,SS 1000 Grinder/Polisher - LECO CorporationThe SS1000 is an 8-inch (200 mm), dual-design grinder/polisher ideal for the . base unit, or with an oscillating head for semi-automatic sample preparation.
grinding polishing head